**Infineon EconoDUAL™ 3 1200V/1.4mΩ CoolSiC™ SiC MOSFET Half-Bridge Module**
The module features the enhanced first-generation M1H chip, integrated NTC temperature sensor, and PressFIT pins. It is available in two variants:
- A TIM (Thermal Interface Material) pre-applied version (FF1MR12MM1HP_B11)
- A Wave-structured substrate backside version for direct liquid cooling (FF1MR12MM1HW_B11).

**Target Applications:**
- Energy storage systems
- General-purpose motor drives
- Uninterruptible Power Supplies (UPS)
- Electric vehicle charging

**Product Features**
- Low switching losses
- Outstanding gate oxide reliability
- Higher gate threshold voltage
- Increased power output
- Robust integrated body diode
- High cosmic ray robustness
- High-speed switching module
- Overload operating temperature: Tvj(op) = 175°C
- PressFIT pins
- Screw-type power terminals
- Integrated NTC temperature sensor
- Insulated substrate

**Application Benefits**
- High switching frequency
- Reduced volume and size
- Lower system costs
- High thermal efficiency

**Competitive Advantages**
- High switching frequency (>7kHz)
- Optimized for high-speed motor applications

**Application Areas**
- Commercial, construction, and agricultural vehicles (CAV)
- Energy storage systems
- General-purpose motor drives (inverters and converters)
- Motor control
- Uninterruptible Power Supplies (UPS)
- Electric vehicle charging
- Hydrogen production