2025 World Electronics Achievement Awards / STMicroelectronics / ST IGBT HB Series - STGFW50HP65FB2 with 650V/50A TO3PF high speed TFS
STMicroelectronics
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ST IGBT HB Series - STGFW50HP65FB2 with 650V/50A TO3PF high speed TFS
Candidate for:2025 World Electronics Achievement Awards - Power Semiconductor/Driver
With ST very robustness HB2 series IGBT, this new housed in TO3PF package can help our customers save the assembly cost.

So this IGBT is suitable for Air-conditioning power factor correction/Welding and other power supply applications.

Features
• Maximum junction temperature: TJ = 175 °C
• Low VCE(sat) = 1.55 V(typ.) @ IC = 50 A
• Co-packaged protection diode
• Minimized tail current
• Tight parameter distribution
• Low thermal resistance
• Positive VCE(sat) temperature coefficient

Applications
• Welding
• Power factor correction

Here are key advantages and outstanding features:
1. High Efficiency & Low Power Loss
• Ultra-Fast Trench Gate™ IGBT Technology
• Optimized for low conduction and switching losses, improving efficiency in high-frequency applications
• Low VCE (sat) (typical 1.55V at 25°C, 50A), reducing conduction losses
• Fast Switching Speed
• Turn-off time is minimized, suitable for PWM (Pulse-Width Modulation) applications (e.g., motor drives, inverters)

2. Robust Thermal Performance
• Low Thermal Resistance (Rth JC= 1.59°C/W)
• Efficient heat dissipation, allowing higher power handling without overheating
• Wide Operating Temperature Range (-40°C to +175°C)
• Reliable performance in harsh environments

3. Integrated Features for Enhanced Reliability
• Co-Packaged Ultra-Fast Diode (Anti-Parallel Diode)
• Low reverse recovery charge (Qrr) for reduced switching losses in inductive load applications (e.g., motor drives)
• Improved robustness in fault conditions

4. Optimized for Industrial & Automotive Applications
• High Current Capability (50A continuous, 100A pulsed)
• Suitable for high-power converters, UPS, welding machines, and EV charging systems
• 650V Breakdown Voltage (V CES)

5. Compact & Easy-to-Use Package*
• TO3PF Package
• Industry-standard footprint for easy PCB mounting and heat sink attachment
• Good mechanical strength for high-vibration environments

In summary: Why Choose STGFW50HP65FB2?
• Best-in-class efficiency (low V CE (sat) + fast switching)
• High reliability (wide temp range)
• Integrated diode* simplifies design
• Cost-effective for industrial & automotive power systems
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