xMEMS μCooling (part number XMC-2400) is the first all-silicon fan-on-a-chip bringing active cooling to thin, AI-enabled electronics. The world's smallest active cooling device, the 1mm-thin cooling chip generates airflow to actively cool devices such as smartphones, tablets, SSDs, smart glasses which are typically only passively cooled today. The XMC-2400 can also extend to datacenter and automotive applications to perform hyper-localized spot cooling to low power electronics unreachable by larger, conventional active thermal management technologies such as fans and liquid cooling.
Almost universally, electronics have become thermal-limited, not MIPS-limited, causing applications to be throttled or disabled due to heat. Innovative thermal solutions are needed to better remove heat and unlock new features and capabilities enabled by the latest SoCs, CPUs and GPUs, while also delivering sustained performance and improved throughput for new AI applications.
Most innovations in thermal management over the past several years have focused on high power problems due to the rise of GPUs and expansion of datacenters. At just 9mm x 7mm x 1mm thin, xMEMS μCooling brings thermal innovation to small and narrow spaces that are not addressed by conventional fans and liquid cooling. It is the first active cooling solution small and thin enough to be applied to edge AI devices like smartphones.

The single silicon die solution empowers systems designers with a variety of implementation options: a) stand-alone chip package either side or top-vented airflow; b) multi-chip module (MCM), or c) stacked die implementations in advanced 2D/3D packages.
The XMC-2400 provides inaudible, silent cooling. All mechanical movement is in the ultrasound region and is outside the human and animal hearing range.
Competitive Advantage: The XMC-2400 is the world's first all-silicon fan/air pump. At 9x7x1mm, it can deliver silent, active cooling to spaces unreachable by conventional cooling technologies while also delivering semiconductor levels of manufacturing scale, quality and reliability. The XMC-2400 is built on a production-proven piezoMEMS process at 2 of the world's leading high-volume MEMS fabs. With airflow of up to 23cc/sec and a back pressure of over 1,000 Pascals, the XMC-2400 can deliver airflow through very narrow channels and ducts that would stall a conventional fan.
Performance:
xMEMS has thermal models and physical measurements that correlate to within 1% and demonstrate the XMC-2400 is an effective thermal management device. The XMC-2400 measurements demonstrate:
1) Thermal Resistance: 26% reduction (avg.)
2) Temperature Reduction: 20-30% (avg.)
3) Power Headroom: 36% increase (avg.)
A top 5 smartphone OEM has shared with us they observe the following results when integrating the XMC-2400 into a system thermal model of their latest phone: “Reducing 1°C at the phone case for product safety is already very hard and we can reduce it by 5°C w/xMEMS μCooling.”
Product Video: https://youtu.be/5p3U-xMlJ58?si=6vnDdRDRQp2Cutbo