Ultra-thin MLCC (multilayer ceramic capacitor) features extremely thin thickness (maximum thickness 0.11-0.22mm), miniaturization (0201 package), high capacitance (μF level), etc., making it particularly suitable for demanding high-density integration scenarios such as chip embedding and back mounting. Its end applications are not limited to smartphones, wearable devices, portable PCs, etc.

The core advantage lies in saving circuit design space, which can effectively improve chip computing performance and meet the demand for reduced chip height. Compared with standard MLCCs, the ultra-thin version is more suitable for advanced packaging (such as SiP) and is an ideal choice for miniaturized and thin electronic designs.

Currently, there are very few manufacturers globally capable of producing this series of MLCCs, with only a few leading Japanese companies achieving mass production. The successful development of this product by Yageo demonstrates that it has joined the ranks of MLCC industry leaders in technological capability.