RF/Wireless/Microwave-2025 World Electronics Achievement Awards-EE Times

Product：Bluetooth LE 6.0 module ME54BS01-nRF54L15

Recommended reasons： ME54BS01 is equipped with Nordic nRF54L15 SoC, integrated with 128MHz Arm^® Cortex^®-M33 MCU, with a receiving sensitivity of up to -96dBm, and supports industrial-grade wide temperature -40℃~+105℃. The performance has been greatly improved compared with the nRF52 series, and the power consumption has been further reduced. It can meet the needs of most existing customers and has a high cost performance. The size is 23.2*17.4*2mm, with rich peripheral interfaces, 1.5MB non-volatile memory and 256 KB RAM, which is enough to run multiple wireless protocols simultaneously. The module adopts an integrated design, integrated with a high-performance onboard antenna, built-in 32.768KHz crystal oscillator and DCDC circuit, which can help customers simplify the design and reduce development time. ME54BS01 equipped with nRF54L15 series Soc has passed the IoT security level PSA 3 certification, with high security protection, and will provide IoT devices with the processing power required for edge computing and machine learning without adding additional components. The processing power is more than twice that of previous Bluetooth LE modules, suitable for most IoT solutions. At the same time, it also supports Bluetooth LE 6.0, Bluetooth Mesh, Thread and Matter protocols, bringing cost-effective wireless connection solutions to markets such as smart homes and wearable devices. Product Features: 128 MHz Arm Cortex-M33 processor Designed for PSA-certified Level 3 security Supports Bluetooth low energy 6.0and Thread/Matter technology 2.4GHz proprietary protocol supports 4Mbps data rate Provides more GPIO development and use Industrial-grade wide temperature range of -40°C to 105°C to meet the needs of stable operation in different environments. Main advantages: Performance improvement: Compared with the nRF52 series, the performance has been greatly improved. Power consumption reduction: Further reduce power consumption and extend the battery life of the device. Strong compatibility: Support Bluetooth LE 6.0 and be compatible with a variety of devices. Features compared with competitors. Balance of high performance and low power consumption: ME54BS01 controls power consumption lower while ensuring high performance. High integration: Integrates powerful processors and low-power Bluetooth functions, reducing the need for external components. Wide application: Suitable for a variety of IoT applications such as smart home, computer accessories, smart medical care, virtual reality and augmented reality, industrial IoT, etc., with broad market potential.

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STMicroelectronics

Product：High-Performance NFC Reader ST25R300

Recommended reasons： The ST25R300 represents the excellence of a new generation of flagship products, not only innovating in packaging size but also achieving a comprehensive leap in performance. The ST25R300 inherits many excellent features from the previous flagship product ST25R3916B, such as active waveform adjustment, noise suppression, and dynamic power output, while significantly enhancing transmission power and card reading distance in low power card detection mode. In terms of functional compatibility, the ST25R300 demonstrates strong adaptability, fully supporting all reader modes defined by the NFC Forum, including read/write mode, card emulation, peer-to-peer mode, and NFC wireless charging functionality. At the same time, it retains practical features such as AWS and DPO, and is designed in strict compliance with EMVCo^® PCD 3.2a analog and digital standards. This characteristic makes it deeply optimized for highly demanding POS terminal applications, ensuring stable operation even in challenging environments like installing antennas behind LCD screens (where internal components and metal parts of the LCD screen can interfere with RF signals), and quickly completing the EMVCo^® certification cycle. With the deepening development of contactless payments, POS machine reader antennas are increasingly integrated under LCD screens, which enhances the integration of the device but also brings challenges of RF interference. The ST25R300 successfully overcomes the technical challenge of balancing high transmission power with excellent reception sensitivity. It can output up to 2.2W of power while possessing excellent small signal reception performance, which is most intuitively reflected in a significant extension of card reading distance in practical applications.

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Qorvo, Inc.

Product：QM35825 Fully integrated, low-power UWB SoC

Recommended reasons： Leveraging more than a decade of Qorvo’s UWB expertise, the QM35825 includes an impressive 104 dB link budget and on-chip AI and machine learning (ML) processing to significantly enhance ranging accuracy and resilience. With a developer-centric architecture and readily accessible API, this new solution ensures smooth integration into existing ecosystems and accelerates the deployment of innovative UWB applications. The QM35825’s outstanding RF performance, combined with radar capability and fine-ranging accuracy, paves the way for next-generation applications across consumer, industrial and enterprise markets. Currently sampling with key customers and leading network infrastructure providers, the QM35825 demonstrates Qorvo’s commitment to advancing UWB technology with industry-leading performance. To support emerging use cases, Qorvo has a robust partner ecosystem of over 30 companies and an active Tech Forum for collaboration. Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, and Qorvo, a leading RF and power technologies company, have announced availability of a reference application targeting access control systems utilizing Connectivity Standards Alliance’s (CSA) Aliro and Matter. The solution is based on Nordic’s nRF54L Series ultra-low power multiprotocol System-on-Chip (SoC) and Qorvo’s QM35825 ultra-wideband (UWB) SoC. The reference application will enable developers to easily and quickly get started on Aliro and Matter access control - making the smart lock design process accessible for any manufacturer. The QM35825 UWB SoC addresses Aliro’s precision and security requirements by enabling micro-location accuracy and reliable distance ranging. Nordic’s nRF54L Series SoC integrates an ultra-low power multiprotocol 2.4 GHz radio and Arm Cortex-M33 MCU. The SoC brings the ultra-low power consumption and security demanded by smart locks. It features secure-boot, -firmware update, and -storage, as well as offering a trusted execution environment enabled by Arm TrustZone, a cryptographic engine with side-channel leakage protection, and tamper detectors.

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Silicon Labs

Product：SiXG301 Wireless SoC with Advanced 22 nanometer (nm) Process Node

Recommended reasons： Silicon Labs, the leading innovator in low-power wireless solutions, today announced the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometer (nm) process node: the SiXG301 and SiXG302. These highly integrated solutions represent a significant leap forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices. As smart devices grow more sophisticated and compact, the need for powerful, secure, and highly integrated wireless solutions has never been greater. The new Series 3 SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration. Silicon Labs' Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications. "Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency," said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. "With the SiXG301 and upcoming SiXG302 families, we're delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they're plugged in or running on battery power." The SiXG301 and SiXG302 families will initially include "M" devices for multiprotocol, the SiMG301 and SiMG302, and "B" devices optimized for Bluetooth LE communications, the SiBG301 and SiBG302. By leveraging the 22 nm process node for all Series 3 devices, Silicon Labs is addressing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications—from smart cities and industrial automation to healthcare, smart homes, and beyond. These new SoCs offer device makers a scalable, secure platform to create the next wave of innovative, high-performance IoT products.

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Silicon Labs

Product：BG29 Ultra-small, Low-power Bluetooth Wireless SoC

Recommended reasons： BG29 Pushes Envelope of What's Possible in Tiny Devices The new BG29 family of SoCs is equipped with key features such as: • Compact Footprint: With a compact size, the BG29 is available in both WLCSP and QFN packages delivering industry-leading connectivity for a wide range of wireless devices like connected health, asset trackers, and building automation. The WLCSP can be used for tiny devices like battery powered sensors, insulin delivery patches, disposable continuous glucose monitors (CGMs) and other one-time use applications, and smart tooth implants. Meanwhile, the QFN package is ideal for non-size constrained device types such as pulse oximeters, access control, industrial automation and heart rate monitors. • High Memory and Compute with Ultra-Low Power: With 1 MB Flash and 256 kB RAM, BG29 delivers superior performance and processing capabilities for advanced, demanding applications while ensuring low power consumption. The large memory keeps data tracking going even during long smartphone connection breaks. The BG29 enables Bluetooth LE for IoT devices such as portable medical devices, wearables, smart home sensors, asset trackers, and more. • Integrated DCDC Boost and Coulomb Counter: The integrated DCDC Boost on BG29 provides IoT device makers a wide voltage range, enabling single-cell alkaline, Silver-Oxide, and button cells and reducing the device's form factor. The integrated Coulomb Counter enables accurate battery level monitoring on portable medical devices to avoid battery depletion during critical health application usage and enhance the user experience of other wearables and devices. • Industry-Leading Security: Secure Vault High with Virtual Secure Engine provides robust security capabilities protecting the device against scalable local and remote software and hardware attacks by providing advanced encryption, secure key management, and authentication.

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Barrot Technology Co.,Ltd.

Product：BR1601A01/02

Recommended reasons： 1. Technical Team Leadership: The company is recognized as a National Key Specialized and New "Little Giant" Enterprise, a Zhongguancun Frontier Technology Enterprise, a Haidian District Germinal Enterprise in Beijing, and Bluetooth SIG associated member. Deeply involved in the definitions of Bluetooth protocols and driving technological innovation, the company is actively working on Bluetooth interoperability and ecosystem construction. It ranks among the world's leading Bluetooth protocol stack vendors and fabless Bluetooth chip manufacturers, awarded the "Best Contributor Award" by the Bluetooth SIG in 2022.The company's Bluetooth chips are integrated with self-developed core protocol stacks, compatible with all operating systems and processors of different architectures. This solves risks from open-source systems used by industry peers and addresses high costs and non-autonomous control issues caused by relying on foreign IP. The company provides Bluetooth core protocol stack IP, Mesh IP, LE Audio IP, and low-complexity low-latency codec. The Bluetooth protocol stack has been licensed to China's top three smartphone manufacturers, serving as the Bluetooth protocol stack provider for HarmonyOS and Xiaomi Vela systems, and a global partner of Xiaomi Vela. 2. Bluetooth Low Energy Technology: Compliant with Bluetooth v5.4 specification, the technology features special optimization for power consumption. Tested data is as follows, enabling CGM products to achieve over 14 days of continuous operation: RX: 3.8mA@3.3V TX: 4.2mA@0dBm/3.3V ADV: 13μA@1s advertising interval Sleep: 1.4μA Shutdown: 130nA 3. Comprehensive Bluetooth Technology Support: Mesh technology, including standard Mesh protocols and proprietary protocols, enabling large-scale networking; PAwR; AOA. 4. Applied in charging piles, beacons, remote printer, scanners and etc. In 2024, it wins DIN in ESL and CGM, with customer products mass production in 2025. In 2025, the company officially launch the wBMS system developed with this chip.

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Telink Semiconductor（Shanghai） Co., Ltd.

Product：Telink TL322X Series SoC

Recommended reasons： The TL322X is a multi-standard wireless SoC supporting Bluetooth^® LE, Zigbee, RF4CE, Thread, Matter, and proprietary 2.4GHz standards. It integrates two powerful 32-bit RISC-V MCUs, 512KB NVM, up to 384KB SRAM (including retention during deep sleep), 1/2MB embedded flash memory, 12-bit SAR ADC, 16-bit SD-ADC, PWM, and flexible IO interfaces. Main Specifications Operating Frequency: up to 192MHz, supports 24MHz and 32.768kHz crystal oscillators, as well as 24MHz and 32kHz embedded RC oscillators. Location Services: Supports AoA/AoD, Channel Sounding. Power Management: Features low-power modes with current consumption as low as 0.7μA in deep sleep mode. Application Fields The TL322X is suitable for a variety of IoT applications, including wireless gaming, smart home, wireless HID, wearable devices, asset tracking, and automotive applications. Key Advantages High Integration: Reduces external component requirements and lowers costs. Wireless PHY: 2.4GHz 1M ,2M, 4M, 6M; Bluetooth^®LE PHY: LE 2M, LE Coded. Ultra-Low Power Consumption: Ideal for power-sensitive applications. Versatility: Supports multiple wireless standards and rich interfaces for enhanced application flexibility. Competitive Advantages Compared to similar products, the TL322X excels in integration, power efficiency, and versatility. Its highly integrated design reduces PCB area and BOM costs, while its low-power characteristics make it more competitive in battery-powered devices. Additionally, its support for multiple wireless standards provides users with greater choice and flexibility.

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TE Connectivity

Product：FP40 Auto Multi-port Antennas

Recommended reasons： FP40 auto antennas provide a combination of 4G, 5G, CBRS, Wi-Fi, Bluetooth and GNSS to address your connectivity requirements. Each antenna includes 4x5G MIMO capabilities. The product family includes multi-port aerodynamic solutions up to 9 ports, along with a range of additional whip antenna and connector options to suit all major vehicular gateways and routers. Applications of the product: - Emergency Services & Public Safety - Public Transportation - Utility & Repair Vehicles

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TE Connectivity

Product：ProSig Wi-Fi 6E Tri-Band Directional Antennas

Recommended reasons： ProSig 2.4-2.5, 5.15-6.0, 6.0-7.125 GHz tri-band directional array panel antennas are specially designed to complement interior or exterior mounted Wi-Fi 6E wireless network systems. The antennas are supplied with integrated RG58LL plenum-rated cables with RP-SMA connectors for ease of installation. The supplied mounting bracket allows for either pole/mast mounting or direct wall mount configurations. Applications of the product: - WLAN - Wi-Fi - Wi-Fi 7 (802.11be), Wi-Fi 6E (802.11ax), Wi-Fi 6 (802.11ax), Wi-Fi 5 (802.11ac), Wi-Fi 4 (802.11n), 802.11b/g - Automation and control - Outdoor and indoor applications

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Nordic Semiconductor

Product：nRF54L15 Ultra-low-power wireless SoC

Recommended reasons： nRF54L15 wireless SoC integrates an ultra-low-power multiprotocol 2.4 GHz radio and MCU (Microcontroller Unit) functionality, featuring a 128 MHz Arm Cortex-M33 processor and comprehensive peripheral set. The series offers a selection of packages and memory size options with pin-to-pin compatible QFN packages. nRF54L15 is suitable for products using Bluetooth Low Energy, Bluetooth Mesh, Zigbee, Thread, Matter, Amazon Sidewalk, and proprietary 2.4 GHz protocols. In addition, it can run a Wi-Fi stack for the nRF70 Series companion ICs. nRF54L15 is the largest memory option in the nRF54L Series, with 1.5 MB NVM and 256 KB RAM, for more demanding applications, while still being cost-optimized for high-volume applications. nRF54L15 supports Bluetooth Low Energy 6.0, including Channel Sounding (supported in nRF Connect SDK v3.0.1 and later). The standard and additional Bluetooth LE features are supported, including the networking capabilities of Bluetooth Mesh with accompanying Bluetooth NLC (Networked Lighting Control) profiles, and Bluetooth PAwR (Periodic Advertising with Responses) with the ESL profile. All nRF54L wireless SoCs are multiprotocol, supporting Matter and IEEE 802.15.4-2020 based protocols, including Thread and Zigbee, which can be used together with Bluetooth LE for use cases such as secure provisioning or DFU. Ecosystems such as Amazon Sidewalk, Google Find My Device, and Apple Find My are also supported and available with the nRF Connect SDK. In addition to standardized protocols, nRF54L Series supports the implementation of proprietary 2.4 GHz protocols with the new 4 Mbps mode. Additionally, the nRF54L15 can run a Wi-Fi stack for the companion ICs from the nRF70 Series. The nRF54L15 is available in a WLCSP package for demanding and size-constrained products.

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DECO Integration Technology Co., Ltd.

Product：millimeter-wave wireless connection chip DK1668

Recommended reasons： Compared to traditional physical connection methods, the DK1668 chip offers several key advantages: compact size, single-chip integration of all functions, real-time parameter quantification, standard semiconductor manufacturing process, consistent quality, wide coverage range, simple and user-friendly design, and substantial cost reduction potential. In LED all-in-one displays adopting DK1668 (SPI + RGB + FLASH), DECO’s mmWave Wireless Connection Solution eliminates the need for ribbon cables, floating connectors, or fixed connectors between the display module and control board. With this wireless architecture, a 170-inch LED all-in-one display can be fully installed in under one hour. This solution significantly reduces installation time and labor costs, while improving deployment flexibility and ease of layout. By standardizing all interfaces through wireless chips, product upgrades and system integration become more seamless—enhancing compatibility across different modules and enabling rapid deployment in various scenarios. Building on this product, DECO has introduced a wireless “three-in-one” architecture, which further enhances cost-efficiency and installation simplicity for the LED display industry. As large-format displays become increasingly prevalent in applications such as rental screens, conference all-in-one machines, XR virtual production, LED cinema, and home theaters, the demand for quick installation and simplified maintenance is rapidly growing. DECO’s wireless three-in-one design helps shorten the supply chain and improve both operational efficiency and cost structure—making it a highly scalable solution for next-generation LED deployments.

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Chongqing WUQI Microelectronics Co., Ltd.

Product：2x2 Wi-Fi 6+BT Combo chip WQ9201

Recommended reasons： Key features: Adopting WUQI-proprietary RF dual-band architecture and WUQI's original low-power CMOS PA technology, WQ9201 supports dual-band concurrency (DBDC) at 2.4 GHz and 5 GHz and provides the leading RF and baseband performance at extremely low power consumption, achieving high throughput and stable wireless transmission. Applications: This chip has been widely applied to products featuring in fast data transmission, such as smart phones, tablets, PCs, TVs, and set-top-boxes. Key Benefits: As a high-end data transmission 2x2 Wi-Fi + BT dual-mode chip, WQ9201 is on a par with chips of international first-tier manufacturers. Particularly, this chip is in a world-leading place in terms of power consumption performance, reducing PA power consumption by 30%~40% than mainstream products in markets.

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Shenzhen Bluetrum Technology Co., Ltd.

Product：AB575X

Recommended reasons： The AB575X, launched in September 2024, is a highly cost-effective entry-level headphone chip featuring high integration, high performance, and low power consumption. It incorporates a high-performance 32-bit RISC-V processor core with DSP instructions, supports Bluetooth 6.0 dual-mode, and integrates 16-bit high-fidelity audio processing unit, robust drive capability (70mW @ 16Ω, 35mW @ 32Ω), Environmental Noise Cancellation, dynamic bass enhancement, and ultra-low power management (as low as 4.9mA). Available in miniature QFN20, SOP16, and ESOP8 packages for compact designs, it is supported by dedicated software development solutions and tools. Primarily targeting TWS and OWS headphones priced around ¥100, the AB575X dominates the white-label market (22% share) with its highly integrated solution priced at ¥0.56 per unit, significantly reducing customer development costs. Compared to competitors, its RISC-V architecture circumvents ARM licensing fees while addressing mid-to-low-end market gaps in open-ear audio leakage control and driver power optimization—contrasting with BES's focus on premium branded segments.

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Product：

Recommended reasons： ①Product Performance: Bluetooth 5.4/custom 2.4G/NFC + high-speed USB, with wireless performance 60 times that of ordinary BLE. It integrates self-developed 480Mbps high-speed USB PHY, near-field communication (NFC), segment LCD driver, LED dot matrix screen interface, waterproof touch buttons and other peripherals. A single chip responds to multiple types of wireless/wired connection needs, with an integrated structure that saves peripheral chips. ②Competitivity: Equipped with self-developed Qingke RISC-V core and wireless/wired interface technology, it eliminates licensing fees and royalties for third-party IP, boasting long-term marginal cost advantages. Compared with common BLE+NFC and BLE+high-speed USB dual-chip solutions on the market, the CH585 single chip integrates BLE5.4, NFC, and 480Mbps high-speed USB built-in PHY, saving users the cost of external chips and a large number of I/O pins, with compact packaging for more 小巧 product appearance. ③Technological Innovation: The lower-power Qingke RISC-V core, developed with table-free interrupts to improve response speed, and protocol stack application instructions to enhance code density. Based on Qinheng's self-developed RF radio frequency, baseband algorithms and protocol stack technologies, with full self-development from core to interface, combining software and hardware for in-depth optimization, it features fast communication response, low power consumption and long battery life. Supporting BLE5.4 standard and high-performance 2.4G custom protocol with 8,000 data packets per second, its performance is improved by 60 times, easily meeting the stringent performance requirements of high-end wireless applications. ④Application Case Introduction: High-performance professional computer peripherals such as 8kHz high report rate tri-mode wireless mice, as well as low-latency application scenarios in smart home, medical equipment, instruments and meters that require wireless/wired multi-mode connection, LCD segment screen and waterproof touch buttons.

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