Recommended reasons:
TI’s RES60A-Q1 integrated, 1.4kV, single-chip thin-film resistor divider for high-voltage system designs, and eliminates the need for lengthy discrete resistor chains with a single-chip, high-voltage resistor divider in a wide-body SOIC package that achieves 0.1% initial ratiometric precision with a maximum of 0.2% ratiometric drift over a 10-year lifetime – providing accurate and consistent monitoring.
Recommended reasons:
In the Automotive and Commercial Vehicles industries, engineers are continually challenged to provide more electronics in the same space, accommodating faster assembly times to reduce production costs. The MX150 Connector System offers a reduced package size over traditional USCAR connectors and is designed for simple and secure assembly.
Customers are looking for a reliable, robust and proven connector design to use for 48V wiring applications. MX150 Mid-Voltage Connectors use the proven MX150 design, upgraded for a voltage rating of up to 60V.
MX150 Mid-Voltage Connector provides Unique Header for Panel Mount Applications
• Oil-resistant connections for next-generation electric motors
• Header sealed in unmated condition
• Internal connection with (2) stackable 2 x 3 connectors
• External connector rated for USCAR V4 and S3 (with backshell)
• Meets all other aspects of current MX150 product specification
Customers want to meet the market demand for more powerful, higher performance motors using oil cooling and need electrical connectivity that will work with these designs. MX150 Pass-Through Sealed Connectors are designed to enable oil-cooled electric motor technology through a sealed, oil-resistant design.
Low- and Mid-Voltage Capability in the Same Form Factor
MX150 Mid-Voltage Connectors enable automotive manufacturers to upgrade to 48V wiring architecture with minimal design engineering work by employing the proven MX150 form factor. This 48V upgrade capability offers significant cost and weight savings by reducing wiring size in a variety of in-vehicle applications.
Complete System Solution
MX150 offers a complete package solution for 1.50mm connector systems. Designers can choose compatible male and female connectors and terminals that are provided in various plating options to meet specific application needs.
Flexibility and Space Savings
Space and weight savings are more crucial than ever for internal combustion engines (ICE) and battery electric vehicles, due to EPA regulations and the need to reduce battery size. MX150 Connectors offer a wide range of circuit sizes and connector options, providing designers with flexibility and space savings for a variety of automotive applications.
Markets
• Commercial Vehicle
• Industrial
• Connected Home
Recommended reasons:
Infineon's latest CoolMOS™ 8 MOFETs at 600 V are leading the way in high-voltage super junction MOSFET technology worldwide, setting the standard for both technology and price performance on a global scale. The technology increases overall system performance and further reinforces decarbonization in applications such as chargers and adapters, solar and energy storage systems, EV charging, and uninterruptible power supplies (UPS).
The CoolMOS™ 8 SJ MOSFETs have an 18 percent lower gate charge than the CFD7 and 33 percent lower than the P7 series. A reduced gate charge allows for less electric charge to be applied to the gate of a MOSFET to switch it from the off state (non-conducting) to the on state (conducting), enabling a more energy-efficient system performance. Additionally, the CoolMOS™ 8 SJ MOSFETs have the quickest turn-off time in the market and their thermal performance has been improved by 14 to 42 percent compared to the previous generation. The 600 V CoolMOS™ 8 SJ technology is equipped with an integrated fast body diode and is available in SMD-QDPAK, TOLL, and Thin-TOLL 8x8 packages, making it suitable for a wide range of consumer and industrial applications.
Recommended reasons:
Ultra-thin MLCC (multilayer ceramic capacitor) features extremely thin thickness (maximum thickness 0.11-0.22mm), miniaturization (0201 package), high capacitance (μF level), etc., making it particularly suitable for demanding high-density integration scenarios such as chip embedding and back mounting. Its end applications are not limited to smartphones, wearable devices, portable PCs, etc.
The core advantage lies in saving circuit design space, which can effectively improve chip computing performance and meet the demand for reduced chip height. Compared with standard MLCCs, the ultra-thin version is more suitable for advanced packaging (such as SiP) and is an ideal choice for miniaturized and thin electronic designs.
Currently, there are very few manufacturers globally capable of producing this series of MLCCs, with only a few leading Japanese companies achieving mass production. The successful development of this product by Yageo demonstrates that it has joined the ranks of MLCC industry leaders in technological capability.
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