Sensor-2025 World Electronics Achievement Awards-EE Times

Product： ams OSRAM multi-purpose spectral light sensor TCS3448

Recommended reasons： The TCS3448 is a 14-channel highly versatile, multi-purpose spectral light sensor. It is optimized to sense spectral components of ambient light in the visible range. Such spectral information is used for camera enhancement (CCT, AWB, exposure time). The spectral response is defined by individual channels covering approximately 380 nm to 1000 nm with 11 channels centered in the visible spectrum (VIS), plus one near-infrared (NIR) and a clear channel. Applications can be assisted to allow classification of ambient light and an integrated flicker detection channel that can automatically flag ambient light flicker at 50/60 Hz as well as buffer data for externally calculating other flicker frequencies. TCS3448 integrates high-precision optical interference filters directly deposited on photodiodes which are embedded in CMOS silicon. A built-in aperture controls the light entering the sensor array to increase accuracy. A programmable digital GPIO and LED driver enable light source and trigger/sync control. Device control and spectral data access is implemented through a serial I²C 1.2 V/1.8 V interface. The device is available in an ultra-low profile package with dimensions of 3.1 mm x 2 mm x 1 mm. TCS3448 has advanced spectral sensing capabilities, compact design, and ease of integration into existing systems compared to peers. Its ability to accurately detect and measure various light conditions makes it a superior choice for applications requiring precise light analysis. Details: • 11 spectral channels (350-800nm) + clear + flicker + IR channel • Flicker detection up to 1kHz (2kHz sample rate) • Integrated aperture in package FOV +/- 40° • 0.18µ process technology with 1.8V supply and 1.8V or 1.2V I²C • 0.18µ process technology with 1.8V/1.2V I²C and I³C • Area efficient L3.1 x W2.0 x H1.0 mm OLGA package (8 pin) • SW compatible with AS7343 Key benefits & features • Highly versatile multi-purpose spectral sensor: 14 channels between 380 nm and 1000 nm; Reflective, transmissive and emissive applications • Highest sensitivity: Enables ultra-low light operation and enables operation behind dark glass • Low power consumption and minimum I²C traffic: 1.8 V supply voltage, 1.2 V/1.8 V I²C bus voltage, configurable sleep mode, and interrupt-driven device • Ultra-high integration: On chip interference filter technology, integrated LED driver and 6 ADCs, 3.1 mm x 2 mm x 1 mm package outline

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Analog Devices, Inc.

Product：ADMT4000—Single Chip Angle & Multiturn Encoder Position Sensor

Recommended reasons： ADI single-chip angle & multiturn encoder position sensor, ADMT4000, integrates angle detection and passive multiturn memory function (up to support 46 turns, 0 ° to 16,560 °), and can be in the power-down state to maintain the position information with accuracy of ± 0.25 °. This solution can replace the traditional optical encoder or multi-device combination solution without battery backup, significantly reduce the system size, weight and cost, as well as enable customers to solve the pain points in the design of robot joints. ADMT4000 is suitable for industrial automation, robotics and other high-precision scenarios. In the future the expanded multi-turn model will be introduced to meet a wider range of needs. ►Industry’s first single chip Multiturn & Angle position sensor. ►The sensor tracks multiple turns of rotation without Power or Contact. ►This innovative sensor can: • Replace gear reduction mechanisms by combining with single turn sensors • Replace linear transducers including wire harness & connectors • Eliminate the need to continuously power systems where motion monitoring is needed when power is interrupted or switched off. ►The sensor allows for the simplification of mechatronic actuator design, reducing the solution size, weight and costs. • The ADMT4000 provides an absolute measurement range of 46 Turns (0° to 16,560°) with accuracy of ± 0.25 °.

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Goodix Technology

Product：Goodix Ultrasonic Fingerprint Sensor

Recommended reasons： As a pioneering force in in-display biometric technology, Goodix consistently redefines the user authentication experience, staying ahead of evolving display innovations. Utilizing its proprietary CMOS sensor architecture and breakthrough wafer-level acoustic layer processing, Goodix has introduced a next-generation ultrasonic fingerprint solution that is catalyzing a new era of secure, reliable, and intuitive authentication for smart devices. 1. Breakthrough Performance, Unmatched User Experience: Powered by Goodix’s patented CMOS architecture, this ultrasonic sensor achieves an industry-leading signal-to-noise ratio and superior ultrasonic signal penetration, enabling more accurate 3D fingerprint recognition. Users enjoy rapid and highly secure unlocking—even with wet or oily fingers—along with high compatibility with tempered glass protectors for consistently seamless authentication. As a global first, Goodix’s innovative sliding enrollment feature allows users to complete fingerprint registration with just a single tap-and-roll motion, making setup more convenient and efficient. 2. Ultra-thin Design, Flexible Placement: Engineered at under 0.17 mm in thickness, the sensor module’s ultra-slim profile frees valuable internal space for device manufacturers and enables far more flexible, ergonomic placement of the authentication area, adapting perfectly to next-generation device designs. 3. Manufacturing Innovation, Scalable Reliability: Goodix is the first to employ wafer-level acoustic layer processing for ultrasonic fingerprint sensors—streamlining production, reducing supply chain technical barriers and costs, and ensuring robust, reliable delivery. This innovation empowers OEMs to seamlessly integrate advanced biometrics across a rapid product rollout. 4. Driving Industry Adoption and Global Impact: Goodix’s ultrasonic fingerprint solution has filed more than 270 international and domestic patents. The innovative solution has been widely adopted by flagship models from world-leading brands including Xiaomi, vivo, OPPO, and OnePlus, and is quickly expanding into mid- and upper-tier series such as iQOO 13, IQOO neo10, REDMI K80, and realme GT 7. As display technologies advance, Goodix is setting the industry standard, making cutting-edge biometric security accessible to users worldwide.

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onsemi

Product：Advanced Depth Sensor Hyperlux™ ID iToF family

Recommended reasons： Key features: By using onsemi’s new proprietary global shutter pixel architecture and on-board storage, the Hyperlux™ ID family can capture an entire scene and simultaneously process depth measurement in real-time, addressing the limitations of standard iToF sensors and enabling depth sensing up to 30 meters. Specifications: The Hyperlux™ ID family includes 1.2MP global shutter 3.5µm BSI pixel sensors. The AF0130 model also features onboard processing to simplify integration and reduce system costs. For customers who prefer to integrate their own depth algorithms, the AF0131 allows this capability for added flexibility. Target Applications: Hyperlux™ ID is suited for enhance Facial recognition, gesture detection and 3D video conferencing in commercial applications, as well as a broad range of industrial environments such as: Automation and Robotics, Manufacturing and Quality Control, Logistics and Material Handling, Agriculture and Farming, Access Control Systems. Competitive Advantages: Traditionally iToF sensors have been limited in their use due to minimal range, poor performance in harsh light and an inability to calculate depth on moving objects. With the ability to provide precision measurements of moving objects and high-resolution images, the Hyperlux™ ID family can help reduce errors and downtime and optimize processes in manufacturing systems to lower operational costs. Its depth sensing up to 30 meters or four times further than standard iToF sensors, all within a smaller form factor. Additionally, the sensor family is capable of producing both monochrome (black and white) images and depth information at the same time. By combining these two outputs, the sensor can provide a comprehensive view of the environment without requiring separate sensors for visual and depth data.

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Texas Instruments

Product：LMH13000 High-speed, voltage-controlled current output driver

Recommended reasons： The LMH13000 is the industry’s first integrated laser driver to deliver an ultra-fast 800ps rise time and 50mA to 5A adjustable output current with only 2% variation across temperature, enabling lidar modules in automobiles and autonomous mobile robots to measure objects more accurately and at up to 30% longer distances than today’s lidar systems. A rise and fall time of 800ps for pulsed current-output capability, and active current control supporting up to 1A continuous or 5A pulsed current, depending on frequency, up to 250MHz. The device’s short pulse width generation and current control enable the system to meet Class 1 FDA eye safety standards. Using multiple LMH130000 devices in parallel can increase the amount of current going to the laser to as much as 5A. Since the LMH13000 does not require an external FET nor large capacitors, it is possible to decrease the size of the laser driver solution by four times compared to discrete solutions. Because of the integration, companies can save an average of 30% on system costs from previous lidar module system designs.

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GalaxyCore Inc.

Product：0.61μm 50MP CIS GC50F6

Recommended reasons： GalaxyCore has pioneered non-stacked high-resolution CIS solutions, breaking the industry’s reliance on stacked structures and driving innovation in small-pixel technology. The GC50F6 is the world’s first non-stack CIS with 0.61 µm small pixels, based on the advanced GalaxyCell^® 2.0 process. It combines FPPI^®Plus pixel isolation with BDTI deep trench design, greatly enhancing low-light signal-to-noise ratio and image quality. Featuring single-frame HDR and PDAF phase detection autofocus, it achieves wide dynamic range and fast, accurate focusing. With a 1/2.88” optical format — the smallest among 50MP CIS products — the GC50F6 enables thinner camera modules, addressing the industry’s demand for high resolution and slim form factors simultaneously. This innovation promotes the CIS industry’s evolution towards smaller pixels, higher performance, and lighter modules.

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Time Vision

Product：Reflective Encoder IC TVOERH080P

Recommended reasons： The TVOERH080P is a three-channel, lensless reflective optical encoder chip with an integrated infrared LED, enabling an exceptionally compact design. Its high-density photodiode (PD) phase array delivers superior signal quality with an 80μm grating pitch. Customizable code wheel diameters and scale lengths are available, while pin-configurable interpolation supports 1×, 2×, 4×, 8×, or 16× signal subdivision. In digital mode, this chip provides dual-channel (AB) quadrature digital outputs and a third digital index (Z) channel. In analog mode, it generates dual-channel differential analog signals (Sin+/Sin-/Cos+/Cos-) for direct connection to external interpolation circuits. Integrating a near-IR LED and photodetection circuitry, the chip enables non-contact measurement. Its unified reflective structure requires no optical alignment, significantly relaxing mechanical tolerances during installation. This compact solution is ideal for space-constrained applications like miniaturized motors, precision instruments, and robotic joints. Compared to competing products, the TVOERH080P adapts to a broader range of code wheels, resists contamination more effectively, achieves higher output frequencies, and offers a smaller footprint with enhanced reliability which are essential qualities for essential for aerospace and specialized industrial uses.

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AlpsenTek

Product：ALPIX-Pizol (APX014)

Recommended reasons： ALPIX-Pizol^® is a 1/4-inch vision sensor composed of 1.3M GESP™ (Global Event Sensing Pixel) pixels. It offers three working modes: image, event, and fusion. In each working mode, you can choose between regular and low-power Settings. Millisecond-level switching can be achieved between modes. Key technological advantages: 1. Superior high-speed performance in low-light conditions: It can still output motion information equivalent to 1000 fps in low-light environments (0.1 lux ambient light, lens parameters 6 mm f/1.2), enhancing the rapid perception capability of low-light scene devices. 2. High-speed motion capture capability in high dynamic range: ALPIX-Pizol^® has the ultimate ability to maintain a dynamic range of 120 dB per frame at full resolution and a high frame rate of 1000 fps, easily handling complex scenarios such as extreme lighting and high light ratio, surpassing global image sensors of the same level. Compared with high-end imported global CMOS sensors, it adds event data and offers a higher cost performance. 3. Ultra-low power consumption advantage: Through EvMo™ technology, motion features within pixels are extracted, significantly reducing the sensor's power consumption in EVS mode, which is only 1/20 to 1/5 of that of traditional global exposure image sensors. 4. Reduce data redundancy and system computing power consumption: In event mode, only change information is perceived to enhance the real-time performance of the system. The amount of event data generated per unit time is only 10-20% of that of traditional image sensors, reducing computing power, transmission bandwidth and storage pressure, and improving system energy efficiency. Reduce the carbon footprint of the visual AI system and significantly lower the application cost. We have conducted joint pre-research with leading manufacturers in mobile phones, consumer electronics, security and other fields.

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SmartSens Technology (Shanghai) Co., Ltd.

Product：SmartSens SC1235HGS: 12MP High-Performance CMOS Image Sensor for ITS

Recommended reasons： The SC1235HGS is a high-performance 12-megapixel global shutter CIS designed for ITS applications, built on SmartSens' advanced SmartGS™-2 Plus technology platform and featuring Lightbox IR^® near-infrared enhancement technology. It delivers superior imaging capabilities with high sensitivity, wide dynamic range, high frame rate, and low noise performance. Leveraging SmartSens' SmartGS™-2 Plus technology, the SC1235HGS achieves simultaneous pixel exposure across the entire sensor, effectively suppressing motion distortion and blurring to capture crisp images of fast-moving vehicles—providing reliable support for ITS visual systems in monitoring high-speed traffic flow. Through optimizations in sensitivity, dynamic range, and noise performance, the SC1235HGS significantly enhances image capture quality, delivering clear and stable high-quality images in both bright daylight and low-light nighttime conditions, ensuring efficient and accurate operation of intelligent traffic management systems. Additionally, the BSI (Back-Side Illumination) architecture, combined with SmartSens' Lightbox IR^® technology, enhances sensitivity across both visible and near-infrared (NIR) spectra. Equipped with SmartSens' advanced PixGain technology, the SC1235HGS produces detailed, high-definition images in varying lighting conditions—from low-light nights to bright daylight—ensuring consistent imaging performance. Designed for the demanding outdoor environments typical of ITS applications, the SC1235HGS optimizes high-temperature performance, frame rate, and shutter efficiency, minimizing the impact of heat on image quality while improving high-speed vehicle capture accuracy. These enhancements ensure long-term reliability for ITS vision systems in real-world deployments.

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SiFirst Technologies Guangdong Limited

Product：SDC™ High Performance AP OIS Driver IC with Integrated Hall Sensor SFM8801

Recommended reasons： SFM8801 is a high-performance Actuator driver IC. It consists of integrated silicon Hall sensor, High resolution ADC, DAC, software defined controller and 1ch H-bridge for Actuator driving. And it provides 32 Bytes EEPROM and 512 Bytes eFlash for user free access memory. The SFM8801 can accurately detect the linear motion of the magnet embedded in the actuator. SFM8801 operates from 2.65V to 3.6V and communication using I2C. The I2C speed can be up to 3.4MHz. It can be used for the APOIS function of the mobile camera.

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Vishay Intertechnology

Product：VEML4031X00 ambient light sensor

Recommended reasons： The industry’s first AEC-Q100 qualified rectangular ambient light sensor, Vishay’s VEML4031X00 features an ALS and highly sensitive IR photodiode in an opaque 4.38 mm by 1.45 mm surface-mount package with a low 0.6 mm profile. Offering half the width of previous-generation solutions, the device allows for easier integration into space-constrained designs, such as bezel-less center control displays. Highly accurate measurements are supported due to the spectral sensitivity of the Automotive Grade sensor, which matches that of the human eye, while its IR channel allows for light source differentiation. With an ambient light range from 0 lx to 172 000 lx, the VEML4031X00 will not saturate in daylight, while its high sensitivity of 0.0026 lx/ct allows the device to be placed behind dark cover glass. Offering a high operating temperature range from -40 °C to +110 °C, the VEML4031X00 is optimized for display backlight controls, infotainment systems, rearview mirror dimming, interior lighting control systems, and heads-up displays. The sensor supports the easy to use I²C bus communication interface for these applications and offers an interrupt function. The VEML4031X00 features a supply voltage range of 2.5 V to 3.6 V, I²C bus voltage range of 1.7 V to 3.6 V, and low shut down current consumption of 0.5 μA typical. RoHS-compliant, halogen-free, and Vishay Green, the device offers a Moisture Sensitivity Level of 2a and a floor life of four weeks in accordance with J-STD-020.

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Azoteq

Product：The high-performance multi-channel inductive sensing chip IQS9320 creates a brand-new depth of pressure perception and linearity

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Shanghai Orient-Chip Technology Co.,LTD.

Product：OCH183X High Precision Automotive Hall Effect Switch

Recommended reasons： The OCH183X Series of Hall-effect switches are AEC Q100 qualified for 12V automotive applications .These sensors are temperature-stable and suited for operation over extended junction temperature ranges up to 170°C. They are available in active high and active low variants for ease of integration into electronic subsystems. The devices include on-board reverse-battery and overvoltage protection for operating directly from an automobile battery, as well as protection from shorts to ground by limiting the output current until the short is removed. The device is especially suited for operation from unregulated supplies. The OCH183X series are available in SIP-3L, SOT23-3L and SOT-23 package. Both packages are lead (Pb) free, with 100% matte-tin-plated leadframes. Features ◼ AEC-Q100 qualified ◼ Wide operating voltage range: 3.0V~28V ◼ Operating temperature range: -40°C ~ +170°C ◼ Output short-circuit protection ◼ EOS protection ◼ Temperature compensation ◼ Reverse polarity protection ◼ Open-Drain pre-driver ◼ Package: SIP-3L、SOT23-3L、SOT-23 Applications ◼ Automotive and industrial safety systems ◼ Industrial motors/encoders ◼ Trunk/door/liftgate/wiper motors ◼ Electronic power steering (EPS) ◼ Brush-less DC Motor ◼ Speed measurement

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xMEMS Labs, Inc.

Product：XMC-2400 µCooling fan-on-a-chip

Recommended reasons： xMEMS μCooling (part number XMC-2400) is the first all-silicon fan-on-a-chip bringing active cooling to thin, AI-enabled electronics. The world's smallest active cooling device, the 1mm-thin cooling chip generates airflow to actively cool devices such as smartphones, tablets, SSDs, smart glasses which are typically only passively cooled today. The XMC-2400 can also extend to datacenter and automotive applications to perform hyper-localized spot cooling to low power electronics unreachable by larger, conventional active thermal management technologies such as fans and liquid cooling. Almost universally, electronics have become thermal-limited, not MIPS-limited, causing applications to be throttled or disabled due to heat. Innovative thermal solutions are needed to better remove heat and unlock new features and capabilities enabled by the latest SoCs, CPUs and GPUs, while also delivering sustained performance and improved throughput for new AI applications. Most innovations in thermal management over the past several years have focused on high power problems due to the rise of GPUs and expansion of datacenters. At just 9mm x 7mm x 1mm thin, xMEMS μCooling brings thermal innovation to small and narrow spaces that are not addressed by conventional fans and liquid cooling. It is the first active cooling solution small and thin enough to be applied to edge AI devices like smartphones. The single silicon die solution empowers systems designers with a variety of implementation options: a) stand-alone chip package either side or top-vented airflow; b) multi-chip module (MCM), or c) stacked die implementations in advanced 2D/3D packages. The XMC-2400 provides inaudible, silent cooling. All mechanical movement is in the ultrasound region and is outside the human and animal hearing range. Competitive Advantage: The XMC-2400 is the world's first all-silicon fan/air pump. At 9x7x1mm, it can deliver silent, active cooling to spaces unreachable by conventional cooling technologies while also delivering semiconductor levels of manufacturing scale, quality and reliability. The XMC-2400 is built on a production-proven piezoMEMS process at 2 of the world's leading high-volume MEMS fabs. With airflow of up to 23cc/sec and a back pressure of over 1,000 Pascals, the XMC-2400 can deliver airflow through very narrow channels and ducts that would stall a conventional fan. Performance: xMEMS has thermal models and physical measurements that correlate to within 1% and demonstrate the XMC-2400 is an effective thermal management device. The XMC-2400 measurements demonstrate: 1) Thermal Resistance: 26% reduction (avg.) 2) Temperature Reduction: 20-30% (avg.) 3) Power Headroom: 36% increase (avg.) A top 5 smartphone OEM has shared with us they observe the following results when integrating the XMC-2400 into a system thermal model of their latest phone: “Reducing 1°C at the phone case for product safety is already very hard and we can reduce it by 5°C w/xMEMS μCooling.” Product Video: https://youtu.be/5p3U-xMlJ58?si=6vnDdRDRQp2Cutbo

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xMEMS Labs, Inc.

Product：Sycamore (XNU-1000-NC) 1mm Thin Full-Range MEMS Loud Speaker for Smart Glasses

Recommended reasons： Sycamore by xMEMS is the world’s smallest, high-fidelity solid-state speaker engineered for smart glasses. With a package size of 19 x 5.3 x 1.28mm and a weight of 150milligrams, Sycamore is up to 90% lighter and 70% smaller than traditional speakers. Sycamore enables stylish, all-day wearable glasses without compromising sound quality. Its ultra-compact design frees space for batteries, sensors, and processors—key for AI-enabled, context-aware experiences like real-time translation, navigation, and voice assistants. Sycamore’s superior part-to-part consistency ensures precise beamforming, boosting DSP-driven features like privacy and conversation modes. With full-range bandwidth, low distortion, and crystal-clear voice clarity even in noisy environments, Sycamore delivers immersive audio performance in constrained spaces where conventional speakers fail. IP58-rated and shock-resistant, it’s built for active lifestyles and next-gen mobile computing. With the smart glasses market expected to grow from $6.7 billion in 2024 to $19.3 billion by 2032 at a CAGR of 14.3%, Sycamore-N’s size, weight, and performance advantages will help enable the market to meet this projected growth. World’s First Solid-State MEMS Speaker for Wearables: Sycamore-N replaces legacy coil-and-magnet drivers with a piezoelectric, monolithic silicon MEMS architecture. This solid-state approach eliminates moving coils and magnets, achieving an ultra-compact form factor (1.28mm thin) and 90% weight reduction—a breakthrough enabling stylish, all-day wearable smart glasses. This innovation is protected by over 250 patents worldwide covering MEMS speaker architectures, fabrication processes, and ultrasonic digital sound reproduction delivering unprecedented miniaturization, durability (10,000g shock tolerance),and performance scalability for next-generation wearables. Precision Engineering for Next-Gen Audio Experiences: Sycamore-N delivers superior part-to-part consistency unmatched by traditional speakers, enabling advanced DSP features like directional audio, privacy modes, and conversation focus. It supports high SPL in near-field constrained spaces, delivering clear, immersive sound for AI-powered smart glasses. The solid-state design also eliminates electromagnetic interference (EMI), a critical advantage in tightly integrated electronics. Semiconductor Manufacturing Scalability: Fabricated using standard MEMS processes, Sycamore-N leverages wafer-level manufacturing for high precision and volume scalability. This allows faster innovation cycles and ensures consistent performance across millions of units—a critical enabler for mainstream adoption of smart glasses as everyday personal assistants. Product Video: https://youtu.be/cSWm741OTEo?si=acKD7_MEJy0qttDp

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